AlN Filler for Thermal Interface Materials

The 80μm Aluminum Nitride (AlN) filler powder developed by Xiamen Juci Technology Co., Ltd. is an advanced ceramic material characterized by high purity, superior thermal conductivity, and low dielectric loss. Specifically designed for applications in electronic packaging, composite materials, and thermal interface materials, its unique particle size distribution (D50≈80μm) and exceptional performance significantly enhance the thermal conductivity of matrix materials, meeting the heat dissipation demands of high-power electronic devices. Key Features: 1、Exceptional Thermal Conductivity Theoretical thermal conductivity of 170-200 W/(m·K), effectively addressing thermal management challenges in electronic devices. 2、Precise Particle Size Control Average particle size (D50) of 80μm with uniform distribution, ensuring excellent dispersibility and compatibility with resin, metal, or ceramic matrices. 3、High Purity & Low Oxygen Content Purity ≥99%, oxygen content ≤1%, guaranteeing chemical stability and electrical insulation, ideal for high-frequency and high-voltage environments. 4、Low Dielectric Constant & Loss Low dielectric constant (ε≈8.8) and minimal dielectric loss (tanδ<0.001), suitable for high-frequency circuit packaging. 5、Outstanding Mechanical Properties High hardness and wear resistance, enhancing the mechanical strength of composite materials.